Title of article :
Ultrasonic soldering in electronics
Author/Authors :
Lanin، نويسنده , , V.L.، نويسنده ,
Issue Information :
فصلنامه با شماره پیاپی سال 2001
Pages :
7
From page :
379
To page :
385
Abstract :
Ultrasonic (US) soldering of electronic components, as an alternative to flux soldering, is environmentally friendly, improves the quality of soldered connections at the mounting elements after long-term storage, and allows the use of lead-free solders. Methods of US solder melt activation, lead-free solders in US soldering and glass–ceramic capacitor metallization processes have been investigated.
Keywords :
ultrasonic , Electronic components , soldering
Journal title :
Ultrasonics Sonochemistry
Serial Year :
2001
Journal title :
Ultrasonics Sonochemistry
Record number :
2188404
Link To Document :
بازگشت