Title of article
Pixel detector modules using MCM-D technology
Author/Authors
Grah، نويسنده , , Ch، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2001
Pages
8
From page
211
To page
218
Abstract
For the upcoming ATLAS–Experiment at CERN it is planned to build a large area Pixel Detector, providing more than 100×106 sensor cells. For the innermost layer, the B–Physics layer, it is planned to use MCM–D technology to perform the signal interconnections and power distribution on the modules. Focus of this paper is to give an introduction to this technology and present measurements on single chip MCM–D assemblies and a full scale MCM–D module prototype.
Keywords
Multi chip module , MCM-D , Thin film , Flip chip , Bump bonding , ATLAS , pixel
Journal title
Nuclear Instruments and Methods in Physics Research Section A
Serial Year
2001
Journal title
Nuclear Instruments and Methods in Physics Research Section A
Record number
2191227
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