Author/Authors :
Lindner، نويسنده , , M. and Fischer، نويسنده , , P. and Florin، نويسنده , , S. and Gِppert، نويسنده , , R. and Hausmann، نويسنده , , J. and Ludwig، نويسنده , , J. and Runge، نويسنده , , K. and Schwarz، نويسنده , , C. and Sِldner-Rembold، نويسنده , , A. and Wermes، نويسنده , , N.، نويسنده ,
Abstract :
Hybrid pixel detectors for medical X-ray imaging applications with Si and GaAs sensors are compared. Both sensor types are bump-bonded onto the MPEC single photon counting pixel read out chip. The image homogeneity and count rate of the two assemblies are compared. For the GaAs assembly the active layer thickness and charge collection efficiency have been measured.
Keywords :
Pixel detector , Photon counting , GaAS , Silicon , x-ray imaging , CCE , Active layer
