Title of article
Characterization of indium and solder bump bonding for pixel detectors
Author/Authors
Cihangir، نويسنده , , S and Kwan، نويسنده , , S، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2002
Pages
6
From page
670
To page
675
Abstract
A review of different bump-bonding processes used for pixel detectors is given. A large-scale test on daisy-chained components from two vendors has been carried out at Fermilab to characterize the yield of these processes. The vendors are Advanced Interconnect Technology Ltd. (AIT) of Hong Kong and MCNC in North Carolina, USA. The results from this test are presented and technical challenges encountered are discussed.
Keywords
Fine pitch solder bumps , Fluxless soldering , Pixel detectors , Indium bumps
Journal title
Nuclear Instruments and Methods in Physics Research Section A
Serial Year
2002
Journal title
Nuclear Instruments and Methods in Physics Research Section A
Record number
2193588
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