Recent progress in sensor- and mechanics-R&D for the Belle II Silicon Vertex Detector

The Belle experiment at the KEKB electron/positron collider in Tsukuba (Japan) was successfully running for more than ten years. A major update of the machine to SuperKEKB is now foreseen until 2015, aiming a peak luminosity which is 40 times the peak value of the previous system. This also requires a redesign of the Belle detector (leading to Belle II) and especially its Silicon Vertex Detector (SVD), which surrounds the beam pipe. ture Belle II SVD will consist of four layers of double-sided silicon strip sensors based on 6 in. silicon wafers. Three of the four layers will be equipped with trapezoidal sensors in the slanted forward region. Moreover, two inner layers with pixel detectors based on DEPFET technology will complement the SVD as innermost detector. Since the KEKB-factory operates at relatively low energy, material inside the active volume has to be minimized in order to reduce multiple scattering. This can be achieved by arranging the sensors in the so-called “Origami chip-on-sensor concept”, and a very light-weight mechanical support structure made from carbon fiber reinforced Airex foam. Moreover, CO 2 cooling for the front-end chips will ensure high efficiency at minimum material budget. s paper, an overview of the future Belle II SVD design will be given, covering the silicon sensors, the readout electronics and the mechanics. A strong emphasis will be given to our R&D work on double-sided sensors where different p-stop layouts for the n-side of the detectors were compared. Moreover, this paper gives updated numbers for the mechanical dimensions of the ladders and their radii.