Author/Authors :
Da Vià، نويسنده , , Cinzia and Boscardin، نويسنده , , Maurizio and Dalla Betta، نويسنده , , Gian-Franco and Haughton، نويسنده , , Iain and Grenier، نويسنده , , Philippe and Grinstein، نويسنده , , Sebastian and Hansen، نويسنده , , Thor-Erik and Hasi، نويسنده , , Jasmine and Kenney، نويسنده , , Christopher and Kok، نويسنده , , Angela and Parker، نويسنده , , Sherwood and Pellegrini، نويسنده , , Giulio and Povoli، نويسنده , , Marco and Tzhnevyi، نويسنده , , Vladislav and Watts، نويسنده , , Stephen J.، نويسنده ,
Abstract :
Vertex detectors for the next LHC experiments upgrades will need to have low mass while at the same time be radiation hard and with sufficient granularity to fulfil the physics challenges of the next decade. Based on the gained experience with 3D silicon sensors for the ATLAS IBL project and the on-going developments on light materials, interconnectivity and cooling, this paper will discuss possible solutions to these requirements.
Keywords :
3D silicon sensor , LHC upgrade , ATLAS IBL , Pixels , Radiation hardness , Micro-channel cooling
