• Title of article

    Rheological properties of organoclay suspensions in epoxy network precursors

  • Author/Authors

    Le Pluart، نويسنده , , L and Duchet، نويسنده , , J and Sautereau، نويسنده , , H and Halley، نويسنده , , P and Gerard، نويسنده , , J.-F، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2004
  • Pages
    13
  • From page
    207
  • To page
    219
  • Abstract
    This paper deals with the evolution of the state of dispersion of organically modified montmorillonites in epoxy or amine precursors. The epoxy prepolymer is a diglycidyl ether of bisphenol A (DGEBA) and the curing agent is an aliphatic diamine with a polyoxypropylene backbone (Jeffamine D2000). The clay dispersion is evaluated at the platelet scale (nanoscopic scale) from X-ray spectrometry [wide-angle X-ray diffraction (WAXD) and small-angle X-ray scattering (SAXS)] and at the aggregates scale (microscopic scale) from rheological analysis. The organoclays used form gels in the monomers above the percolation threshold if no shear is applied and present a mechanical gel/sol transition when shear stress increases. Gel strength and viscosity at high shear rates are linked to the nanometric state of dispersion and reveal the existence of two different organizations depending on organoclay/monomer interactions:(i) he clay shows good interactions with the monomer, a significant swelling of the clay galleries by the monomer is obtained. These swollen particles lead to formation of weak gels which after shearing give high relative viscosity fluids. he clay develops poor interactions with the monomer, the clay tends to reduce its exchange surface with the monomer and leads to a strongly connected gel. Shear breaks down this physical network leading to a very low relative viscosity fluid composed of nonswollen particles keeping a high aspect ratio.
  • Keywords
    physical gel , suspensions , Organophilic montmorillonite , rheology , Epoxy/amine
  • Journal title
    Applied Clay Science:an International Journal on the Application...
  • Serial Year
    2004
  • Journal title
    Applied Clay Science:an International Journal on the Application...
  • Record number

    2220934