Title of article
Novel nanocomposites based on reactive organoclay of l-tyrosine and amine end-capped poly(amide–imide): Synthesis and characterization
Author/Authors
Mallakpour، نويسنده , , Shadpour and Dinari، نويسنده , , Mohammad، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2013
Pages
7
From page
67
To page
73
Abstract
In the present study, a series of nanocomposite materials were successfully prepared using a poly(amide–imide) (PAI) matrix and novel reactive organoclay as a reinforcing agent. The organoclay was synthesized from Cloisite Na+ and protonated form of l-tyrosine amino acid via ion-exchange reaction. It was confirmed by Fourier transform infrared spectroscopy, X-ray powder diffraction, field emission scanning electron microscopy, transmission electron microscopy and thermogravimetry analysis techniques. An optically active PAI was synthesized via solution polycondensation reaction of N,N′-(pyromellitoyl)-bis-phenylalanine diacid chloride and 4,4′-diaminodiphenylether. Then it was end-capped with amine end groups near the completion of the reaction to interact chemically with organoclay. Organoclay/PAI nanocomposite films containing different amounts of organoclay were prepared via solution intercalation method through blending of organoclay with the PAI solution. The nanostructures and properties of the organoclay/PAI hybrids were investigated using different techniques. Thermogravimetry analysis results indicated that the addition of organoclay into the PAI matrix increased the thermal decomposition temperatures of the resulting hybrid materials. The presence of amino acids as a biodegradable segment in both novel organoclay and optically active PAI, made the resulting nanostructure materials susceptible for biodegradation.
Keywords
amino acids , Organoclay , Optically active polymer , Clay polymer nanocomposite (CPN) , Poly(amide–imide)
Journal title
Applied Clay Science:an International Journal on the Application...
Serial Year
2013
Journal title
Applied Clay Science:an International Journal on the Application...
Record number
2224519
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