• Title of article

    Analysis of nanobridge tests

  • Author/Authors

    Chan، نويسنده , , Wing Kin and Li، نويسنده , , Jianrong and Wang، نويسنده , , Yong and Zhang، نويسنده , , Shengyao and Zhang، نويسنده , , Tongyi، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2010
  • Pages
    14
  • From page
    283
  • To page
    296
  • Abstract
    This paper analyzes nanobridge tests with consideration of adhesive contact deformation, which occurs between a probe tip and a tested nanobeam, and deformation of a substrate or template that supports the tested nanobeam. Analytical displacement-load relation, including adhesive contact deformation and substrate deformation, is presented here for small deformation of bending. The analytic results are confirmed by finite element analysis. If adhesive contact deformation and substrate deformation are not considered in the analysis of nanobridge test data, they might lead to lower values of Youngʹs modulus of tested nanobeams.
  • Keywords
    nanobridge tests , Size-dependency , Contact compliance , Substrate effect , Finite element , Adhesion , Surface effect
  • Journal title
    Acta Mechanica Solida Sinica
  • Serial Year
    2010
  • Journal title
    Acta Mechanica Solida Sinica
  • Record number

    2227970