Title of article
Analysis of nanobridge tests
Author/Authors
Chan، نويسنده , , Wing Kin and Li، نويسنده , , Jianrong and Wang، نويسنده , , Yong and Zhang، نويسنده , , Shengyao and Zhang، نويسنده , , Tongyi، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2010
Pages
14
From page
283
To page
296
Abstract
This paper analyzes nanobridge tests with consideration of adhesive contact deformation, which occurs between a probe tip and a tested nanobeam, and deformation of a substrate or template that supports the tested nanobeam. Analytical displacement-load relation, including adhesive contact deformation and substrate deformation, is presented here for small deformation of bending. The analytic results are confirmed by finite element analysis. If adhesive contact deformation and substrate deformation are not considered in the analysis of nanobridge test data, they might lead to lower values of Youngʹs modulus of tested nanobeams.
Keywords
nanobridge tests , Size-dependency , Contact compliance , Substrate effect , Finite element , Adhesion , Surface effect
Journal title
Acta Mechanica Solida Sinica
Serial Year
2010
Journal title
Acta Mechanica Solida Sinica
Record number
2227970
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