Title of article :
Fabrication of Nanostructured Electroforming Copper Layer by Means of an Ultrasonic-assisted Mechanical Treatment
Author/Authors :
Qiang، نويسنده , , Liao and Weiping، نويسنده , , Li and Huicong، نويسنده , , Liu and Liqun، نويسنده , , Zhu، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2010
Abstract :
Electroformed copper layer with nanostructure is obtained using a subsequent mechanical treatment under the conditions of ultrasonic vibration according to the demand of high performance material in aeronautics. The microstructure of the electroformed copper layer is observed by optical microscope (OM), scanning electron microscope (SEM) and transmission electron microscope (TEM). The tensile strength is evaluated with a tensile tester. It is found that bulk crystal of electroformed copperʹs surface layer is changed to nanocrystals (about 10 nm in size) after the ultrasonic-assisted mechanical treatment (UMT) but the whole monocrystalline structure still remains. The tensile strength exhibited by the new copper layer is two times better than the regular electroformed copper layer, while the fracture strain remains constant. In addition, the strengthening mechanism of UMT process is proved to be dislocation strengthening mechanism.
Keywords :
electroformed copper layer , Nanostructure , tensile strength , ultrasonic-assisted mechanical treatment
Journal title :
Chinese Journal of Aeronautics
Journal title :
Chinese Journal of Aeronautics