Electrochemical micromachining of micro-dimple arrays on cylindrical inner surfaces using a dry-film photoresist

The application of surface textures has been employed to improve the tribological performance of various mechanical components. Various techniques have been used for the application of surface textures such as micro-dimple arrays, but the fabrication of such arrays on cylindrical inner surfaces remains a challenge. In this study, a dry-film photoresist is used as a mask during through-mask electrochemical micromachining to successfully prepare micro-dimple arrays with dimples 94 μm in diameter and 22.7 μm deep on cylindrical inner surfaces, with a machining time of 9 s and an applied voltage of 8 V. The versatility of this method is demonstrated, as are its potential low cost and high efficiency. It is also shown that for a fixed dimple depth, a smaller dimple diameter can be obtained using a combination of lower current density and longer machining time in a passivating sodium nitrate electrolyte.