Distributions of orientations and misorientations in hot-rolled copper

Local orientations were measured by means of the electron backscatter diffraction technique in hot-rolled pure copper after postdynamic recrystallization. Orientation and misorientation distribution functions, grain boundary misorientation and character distributions, and triple junction distributions were calculated from the local orientation data. The superposition of microstructural features characteristic of both dynamic recrystallization and static recrystallization was observed. The evolution of grain boundary and triple junction distributions are discussed in terms of the recrystallization process.