Author/Authors :
Molleda، نويسنده , , F. and Mora، نويسنده , , J. and Molleda، نويسنده , , F.J. and Carrillo، نويسنده , , E.J. and Mora، نويسنده , , E. and Fonseca، نويسنده , , Ma. P. and Mellor، نويسنده , , B.G.، نويسنده ,
Abstract :
The stress distribution and fracture behaviour of soft soldered single and double lap joints have been studied. Stress analysis has been performed using transmission photoelasticity on plastic models. This allowed the shear stress distribution in the joint overlap to be determined. A fractographic study was also carried out on fractured joints made using a Sn–8% Ag soft solder. This analysis allowed the fracture behaviour of this soft solder to be studied under different states of stress (shear and tension).
Keywords :
fractography , Stress analysis , Photoelasticity , Soft solder
