Title of article :
Microstructure and thermo-electrical transport properties of Cd–Sn alloys
Author/Authors :
Ari، نويسنده , , Audrey M. and Saatci، نويسنده , , B. and Gündüz، نويسنده , , M. and Meydaneri، نويسنده , , F. and Bozoklu، نويسنده , , M.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2008
Pages :
7
From page :
624
To page :
630
Abstract :
The thermophysical transport properties of Cd–Sn alloys have been investigated for six samples. The electrical resistivity measurements were obtained by using a standard dc four-point probe technique in the temperature range of 300 K–550 K. The resistivity of samples increases linearly with temperature and the electrical current mainly flows through the Sn phase channel. The electrical conductivity of samples is inversely proportional to temperature. Also, thermal conductivity of the Cd–Sn alloys was determined. The phonon component contribution of thermal conductivity dominates the thermal conduction processes at T < 500 K. The electronic component contribution of thermal conductivity affects the thermal transport process at T > 500 K. The thermal conductivity of the Cd–Sn alloys also depends on the grain size and grain boundary of the pure Cd and the pure Sn phases in the matrix. The temperature coefficient of resistivity was also determined, which is independent with the alloying elements.
Keywords :
SEM , Cd–Sn alloys , Four-point probe method , thermal conductivity , Electrical resistivity
Journal title :
Materials Characterization
Serial Year :
2008
Journal title :
Materials Characterization
Record number :
2266823
Link To Document :
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