Diffusion bonding titanium to stainless steel using Nb/Cu/Ni multi-interlayer

By using Nb/Cu/Ni structure as multi-interlayer, diffusion bonding titanium to austenitic stainless steel has been conducted. The effects of bonding temperature and bonding time on the interfacial microstructure were analyzed by scanning electron microscope equipped with energy dispersive spectroscope, and the joint strength was evaluated by tensile test. The results showed that Ni atoms aggregated at the Cu–Nb interface, which promoted Cu solution in Nb. This phenomenon forms a Cu–Nb solution strengthening effect. However, such effect would decay by using long bonding time that dilutes Ni atom aggregation, or be suppressed by using high bonding temperature that embrittles the Cu–Nb interface due to the formation of large grown intermetallic compounds. The sound joint was obtained by promoted parameters as 850 °C for 30–45 min, under which a bonding strength around 300 MPa could be obtained.