Preparation of soft solder joints

The preparation of solder joints in electronic applications is not easy because the solder is soft and often surrounded by hard and brittle materials. Smearing, scratching, and structural changes caused by the preparation as well as destruction of the specimens during preparation due to their filigree geometries make the procedure demanding. A sequence has been developed that enables the preparation of soft solder under these difficult circumstances. The preparation and the development of the phases found in solder is explained step by step and illustrated with examples.