Title of article :
Deformation behavior and microstructural evolution during the semi-solid compression of Al–4Cu–Mg alloy
Author/Authors :
Lu، نويسنده , , Yalin and Li، نويسنده , , Miaoquan and Huang، نويسنده , , Weichao and Jiang، نويسنده , , Haitao، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2005
Pages :
8
From page :
423
To page :
430
Abstract :
The effects of the process parameters, including deformation temperature and strain rate, on the deformation behavior and microstructure of an Al–4Cu–Mg alloy, have been investigated through isothermal compression. Experiments were conducted at deformation temperatures of 540 °C, 560 °C, and 580 °C, strain rates of 1 s−1, 1×10−1 s−1, 1×10−2 s−1, and 1×10−3 s−1, and height reductions of 20%, 40%, and 60%. The experimental results show that deformation temperature and strain rate have significant effect on the peak flow stress. The flow stress decreases with an increase of deformation temperature and/or a decrease of the strain rate. Above a critical value of the deformation temperature, the flow stress quickly reaches a steady value. Experimental materials A and B have equiaxed and irregular grains, respectively, prior to deformation. The microstructures vary with the process parameters in the semi-solid state. For material B, the irregular grains transform to equiaxed grains in the process of semi-solid deformation, which improves the deformation behavior.
Keywords :
Al–4Cu–Mg alloy , Isothermal compression , Deformation behavior , Semi-solid state , microstructure
Journal title :
Materials Characterization
Serial Year :
2005
Journal title :
Materials Characterization
Record number :
2270603
Link To Document :
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