Title of article :
Micromechanical model of 3D cross-ply copper matrix composite reinforced with SiC fibres
Author/Authors :
Rيos، نويسنده , , A. and Martيn-Meizoso، نويسنده , , A. and You، نويسنده , , J.-H. and Martيnez-Esnaola، نويسنده , , J.M. and Gil Sevillano، نويسنده , , J. and Fuentes، نويسنده , , M.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2009
Pages :
8
From page :
2559
To page :
2566
Abstract :
A 3D cross-ply micromechanical model is used to analyse the thermomechanical behaviour of copper matrix composite reinforced with SiC fibres, when subjected to cyclic loadings at high temperature. The copper matrix composite is reinforced with 45% fibre volume fraction. A cohesive model is employed to capture the influence of the debonding interface in the composite, during the consolidation and subsequent thermal and mechanical loading.
Keywords :
High temperature fatigue , Finite element analysis , Composites , Debonding , creep–fatigue interaction
Journal title :
Engineering Failure Analysis
Serial Year :
2009
Journal title :
Engineering Failure Analysis
Record number :
2338756
Link To Document :
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