Title of article
Fiducial marks as measures of thin film crack arrest toughness
Author/Authors
Volinsky، نويسنده , , Alex A and Kottke، نويسنده , , Michael W. and Moody، نويسنده , , Neville R and Gerberich، نويسنده , , William W، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2002
Pages
5
From page
1511
To page
1515
Abstract
Carbon fiducial marks are formed during thin film local delamination processes induced either by indentation, forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination processes, outlining the crack tip opening angle, which can be used to back calculate thin film adhesion using elastic or plastic analyses presented in the paper.
Keywords
Delamination , Crack tip opening angle , Fiducial marks , Adhesion , fracture , Thin films , crack arrest
Journal title
ENGINEERING FRACTURE MECHANICS
Serial Year
2002
Journal title
ENGINEERING FRACTURE MECHANICS
Record number
2340189
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