Title of article :
Pre-cracking technique for fracture mechanics experiments along interface between thin film and substrate
Author/Authors :
Hirakata، نويسنده , , Hiroyuki and Kitamura، نويسنده , , Takayuki and Kusano، نويسنده , , Takato، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2005
Pages :
13
From page :
1892
To page :
1904
Abstract :
Utilizing the difference in interface strength due to fabrication process, a technique for producing a sharp pre-crack between a thin film and a substrate is proposed. A cracked specimen for examining fracture toughness of interface between a sputtered copper (Cu) thin film and silicon (Si) is made by the method. A vacuum-evaporated Cu thin film, which has poor adhesion to Si, is inserted between the sputtered Cu thin film and the Si substrate as a release layer. The release layer debonds from the Si substrate at very low load, and the sharp pre-crack is successfully introduced along the interface. Using the pre-cracked specimen, the interface fracture toughness test is conducted and the critical J-integral, JC, is evaluated as about 1 J/m2 for the sputtered Cu/Si interface.
Keywords :
Thin film , Interface , Interface Crack , Pre-crack , Copper film , Fracture mechanics , material testing , fracture toughness
Journal title :
ENGINEERING FRACTURE MECHANICS
Serial Year :
2005
Journal title :
ENGINEERING FRACTURE MECHANICS
Record number :
2341078
Link To Document :
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