Fracture load prediction of lead-free solder joints

Continuous and discrete SAC305 solder joints of different lengths were made between copper bars under standard surface mount (SMT) processing conditions, and then fractured under mode-I loading. The load–displacement behavior corresponding to crack initiation and the subsequent toughening before ultimate failure were recorded and used to calculate the critical strain energy release rates. The fracture of the discrete solder joints was then simulated using finite elements with two different failure criteria: one in terms of the critical strain energy release rate at initiation, Gci, and another based on a cohesive zone model at the crack tip (CZM). Both criteria predicted the fracture loads reasonably well. In addition, the CZM was able to predict accurately the overall load–displacement behavior of the discrete joint specimen. It could also predict the load sharing that occurred between neighboring solder joints as a function of joint pitch and adherend stiffness. This has application in the modeling of the strength of solder joint arrays such as those found in ball grid array packages.