Title of article
An analytical singular element for interface cracks in bi-material Kirchhoff plate bending
Author/Authors
Yao، نويسنده , , Weian and Wang، نويسنده , , Shan، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2012
Pages
14
From page
103
To page
116
Abstract
By introducing appropriate transformations, a circular sector Kirchhoff plate bending composed of dissimilar materials with both straight sides free is led into symplectic duality system in this paper. The problem is solved by using the symplectic eigenfunction expansion method, and analytical expressions of symplectic eigenvalues and eigensolutions are derived. Using the symplectic eigensolutions as a displacement model, an analytical singular element is developed for the interface crack. Bending stress intensity factors can be determined directly from the expansion coefficients of the eigensolution. Numerical results show that the present method has a high accuracy in the calculation of stress intensity factors.
Keywords
Symplectic duality system , Kirchhoff plate , Interface Crack , Stress intensity factor , Analytical singular element
Journal title
ENGINEERING FRACTURE MECHANICS
Serial Year
2012
Journal title
ENGINEERING FRACTURE MECHANICS
Record number
2343709
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