Author/Authors :
Chen، نويسنده , , Chuantong and Koiwa، نويسنده , , Kozo and Shishido، نويسنده , , Nobuyuki and Kamiya، نويسنده , , Shoji and Omiya، نويسنده , , Masaki and Sato، نويسنده , , Hisashi and Nishida، نويسنده , , Masahiro and Suzuki، نويسنده , , Takashi and Nakamura، نويسنده , , Tomoji and Nokuo، نويسنده , , Takeshi and Nagasawa، نويسنده , , Tadahiro، نويسنده ,
Abstract :
A specimen size effect on the adhesion strength of Cu/insulation layer interface was studied by means of a new elastic–plastic finite element simulation technique. By considering the influence of the plastic zone at the interface crack tip, the adhesion strength appeared almost independent of the specimen size. Since the Cu crystals were far smaller than the specimen dimensions and thus no significant difference should be expected in adhesion strength, it is speculated that an accurate estimation of the plastic zone is essential for micro-scale specimen evaluation.
Keywords :
Cu metallization systems , Elastic–plastic simulation , Local interface strength , Size effect
