Using Topology Optimization to Reduce Stress Concentration Factor in a Plate with a Hole

This paper focuses on reducing stress concentration in a plate with a hole. For this purpose, a novel Reliever Topological Material Elimination (RTME) approach was introduced which uses the topology optimization technique to specify the best areas to remove material in order to refine flow of stress and reduce the Stress Concentration Factor (SCF), consequently. Using the Solid Isotropic Material with Penalization (SIMP) method, topology optimization was formulated. Three major elimination areas were determined from material elimination patterns observed in topology optimization. Two possible RTME cases were proposed numerically. To evaluate the efficiency of the method, finite element analyses were conducted for one previous technique and the results werediscussed. In addition, the results of finite element analysis were validated by some experimental tests. According to the final results, RTME approach gives up to 35.5% stress reduction, 44% SCF mitigation, and decrease about 28% of the initial volume. In comparison with the previous technique, using RTME is more effective in decreasing the SCF and weight of the plate, simultaneously.