Title of article
PARAMETER OPTIMIZATION OF SPUTTERED Ti INTERLAYER USING TAGUCHI METHOD
Author/Authors
Bushroa, A.R. university of malaya - Centre of Advance Manufacturing and Material Processing, Malaysia , Bushroa, A.R. university of malaya - Faculty of Engineering - Department of Engineering Design and Manufacture, Malaysia , Masjuki, H.H. university of malaya - Department of Mechanical Engineering, Malaysia , Muhamad, M.R. Multimedia University - Chancellery Office, Malaysia
From page
140
To page
146
Abstract
The aim of this study was to optimize the process of coating a thin Ti film using a PVD magnetron sputtering system. The Ti thin film acted as an interlayer sandwiched between a substrate and a hard TiSiN coating. The substrates used were glass and high speed steel (HSS). An optimization of the process input parameters was carried out by utilizing Taguchi method. Morphological studies on the resultant coating were done using a field emission scanning electron microscopy (SEM). X-ray diffraction was utilized to analyze the crystal structure of the thin film. Micro scratch test was used to determine the adhesion strength of the coating/substrate system. Thin film Ti interlayers were successfully deposited on the substrates. The subsequent deposited TiSiN coatings on the substrates were very dense and uniform. The optimized input parameters of the Ti interlayer deposition resulted in an improved adhesion strength of the TiSiN coating on the substrate by 28.5%.
Keywords
Ti interlayer , TiSiN coating , Magnetron sputtering , Taguchi method.
Journal title
International Journal of Mechanical and Materials Engineering
Journal title
International Journal of Mechanical and Materials Engineering
Record number
2565909
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