MICROELECTRONICS THERMAL DISSIPATION CHARACTERIZATION USING TRIZ

Thermal dissipation of a microelectronic device is a topic of interest amongst the researchers because poor thermal dissipation may cause reliability problem during customer’s application. One of the factors that caused poor thermal dissipation of a device is the existence of air gap inside the package. Air gap blocks the heat dissipation path of the device, causing the heat to be entrapped inside the device and to the extent of becoming malfunction. In this analysis, TRIZ was proposed through Parameter Change (PC) as one of the principle solutions to increase the effectiveness of identifying poor thermal dissipation devices. Experiment confirmed that TRIZ PC principle was able to identify poor thermal dissipation in microelectronic device even though the device did not have air gaps. Such identification was not possible through traditional approaches, such as XRay or SAM.