Author/Authors :
Idrus, Fairosidi Universiti Teknologi MARA (UiTM) - Faculty of Mechanical Engineering, Malaysia , Yaakob, Yusli Universiti Teknologi MARA (UiTM) - Faculty of Mechanical Engineering, Malaysia , Abdul Razak, Muhammad Universiti Teknologi MARA (UiTM) - Faculty of Mechanical Engineering, Malaysia , Mohamed, Mazlan Universiti Teknologi MARA (UiTM) - Faculty of Mechanical Engineering, Malaysia , Razak, Azli Abd. Universiti Teknologi MARA (UiTM) - Faculty of Mechanical Engineering, Malaysia , Abdullah, Mohd Zulkifly Universiti Sains Malaysia, Engineering Campus - School of Mechanical Engineering, Malaysia , Abdullah, Muhammad Khalil Universiti Sains Malaysia, Engineering Campus - School of Mechanical Engineering, Malaysia
Abstract :
The needfor higher performance of electronic device becomes very important presently. The heal dissipated from the device at high heat flux demand better cooling system for heat removal in order to maintain the performance and reliability of the electronic device. In order to solve this problem, the vapour chamber is introduced as a part ofthe heat remover device. The vapour chamber in this study has an area of 64 mm x 44 mm. The vapour chamber is a two- phase closed flat chamber made of copper. Water is enclosed as the working fluid, and five types of wick structure are used in the 5 mm thickness vapour chamber. The experimental results show that the reclangidar wick structure gives the lowest thermal resistance. The wick structure with the working fluid and the boiling phenomenon is practically effective for a 4 5%fill ratio.
Keywords :
Vapour chamber , Electronic cooling , Heat fha , Wick structure , Fill ratio
