Palm Leaf as a Thermal Insulation Material

This paper presents calculation of thermal conductivity (K) of palm leaf experimentally using Lees disc method to be used as thermal insulator. The thermal conductivity is found to be equal to (k=0.03W/mK) indicating that palm leaf is a good thermal insulator compared to the other insulators. The effect of the thermal insulator thickness on temperature difference, heat transfer coefficient, thermal conductance, thermal resistance, thermal insulation are investigated in this paper. It was found that increasing thickness of the good insulator (such as palm leaf) leads to increasing both thermal resistance and insulation while decreasing both heat transfer coefficient and thermal conductance until specific point which after it they are not affected by thickness (they being constant).