Title of article :
Crystal structure and Hirshfeld surface analysis of a copper(II) complex containing 2-nitrobenzoate and tetramethylethylenediamine ligands
Author/Authors :
Kansiz, Sevgi Department of Fundamental Sciences - Faculty of Engineering, Samsun University, Turkey , Qadir, Adnan M. Department of Chemistry - College of Science - Salahaddin University, Iraq , Dege, Necmi Department of Physics - Faculty of Arts and Sciences - Ondokuz Mayıs University, Turkey , Yongxin, Li Division of Chemistry and Biological Chemistry - Nanyang Technological University, Singapore , Saif, Eiad Department of Computer and Electronic Engineering Technology - Sana'a Community College, Sana'a, Yemen
Abstract :
The reaction of copper(II) sulfatepentahydrate with 2-nitrobenzoic acid and N,N,N′,N′-tetramethylethylenediamine (TMEDA) in basic solution produces the complex bis(2-nitrobenzoato-κO)(N,N,N′,N′-tetramethylethylenediamine-κ2N,N′)copper(II), [Cu(C7H4NO4)2(C6H16N2)] or [Cu(2-nitrobenzoate)2(tmeda)]. Each carboxylate group of the 2-nitrobenzoate ligand is coordinated by CuII atom in a monodentate fashion and two TMEDA ligand nitrogen atoms are coordinate by the metal center, giving rise to a distorted square-planar coordination environment. In the crystal, metal complexes are linked by centrosymmetric C—H⋯O hydrogen bonds, forming ribbons via a R22(10) ring motif. These ribbons are linked by further C—H⋯O hydrogen bonds, leading to two-dimensional hydrogen-bonded arrays parallel to the bc plane. Weak π–π stacking interactions provide additional stabilization of the crystal structure. Hirshfeld surface analysis, dnorm and two-dimensional fingerprint plots were examined to verify the contributions of the different intermolecular contacts within the supramolecular structure. The major interactions of the complex are O⋯H/H⋯O (44.9%), H⋯H (34%) and C⋯H (14.5%).
Keywords :
crystal structure , copper(II) , Hirshfeld surface , 2-nitrobenzoate , tetramethylethylenediamine
Journal title :
Acta Crystallographica Section E: Crystallographic Communications