Title of article :
N,N′-Bis(pyridin-4-ylmeth­yl)oxalamide benzene monosolvate: crystal structure, Hirshfeld surface analysis and computational study
Author/Authors :
Tan, Sang Loon Research Centre for Crystalline Materials - School of Science and Technology - Sunway University, Malaysia , Halcovitch, Nathan R. Department of Chemistry - Lancaster University, United Kingdom , Tiekink, Edward R. T. Research Centre for Crystalline Materials - School of Science and Technology - Sunway University, Malaysia
Pages :
11
From page :
1
To page :
11
Abstract :
The asymmetric unit of the title 1:1 solvate, C14H14N4O2C6H6 [systematic name of the oxalamide molecule: N,N0 -bis(pyridin-4-ylmethyl)ethanediamide],comprises a half molecule of each constituent as each is disposed about a centre of inversion. In the oxalamide molecule, the central C2N2O2 atoms areplanar (r.m.s. deviation = 0.0006 A˚ ). An intramolecular amide-N— HO(amide) hydrogen bond is evident, which gives rise to an S(5) loop. Overall, the molecule adopts an antiperiplanar disposition of the pyridyl rings, and an orthogonal relationship is evident between the central plane and each terminal pyridyl ring [dihedral angle = 86.89 (3)]. In the crystal, supramolecular layers parallel to (102) are generated owing the formation of amide-N— HN(pyridyl) hydrogen bonds. The layers stack encompassing benzene molecules which provide the links between layers via methylene-C— H(benzene) and benzene-C—H(pyridyl) interactions. The specified contacts are indicated in an analysis of the calculated Hirshfeld surfaces. The energy of stabilization provided by the conventional hydrogen bonding (approximately 40 kJ mol1 ; electrostatic forces) is just over double that by the C—H contacts (dispersion forces).
Keywords :
crystal structure , bis­(4-pyridyl­meth­yl)oxalamide , benzene solvate , hydrogen bonding , Hirshfeld surface analysis , computational chemistry
Journal title :
Acta Crystallographica Section E: Crystallographic Communications
Serial Year :
2019
Full Text URL :
Record number :
2625389
Link To Document :
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