Electrodeposition of nano tin film on different substrates in a choline chloride–ethylene glycol deep eutectic solvent containing boric acid

In recent years, Tin has been used in coating of medical and orthopedic instruments, probes, alignment devices, implants and surgical cutting tools. This study examines the electrodeposition of nano tin film on several substrates, including brass, copper, and mild steel, while using a ChCl: EG-based liquid which also contained boric acid. It was found that adding larger amounts of boric acid improved the conductivities of Sn electrolytes; when boric acid was introduced to them, the redox current peaks of Sn decreased with increasing concentrations of boric acid and displayed negative shifts in the deposition peak when performing cyclic voltammetry. SEM was involved to examine the morphologies of Sn deposits. Boric acid was found to improve the homogeneity of the morphologies of the deposited Sn films, leading to the formation of smooth Sn coatings, the associated roughness of which was determined to be 7.642 nm. The Sn deposits’ crystal structure was investigated using X-ray diffraction spectroscopy.