Title of article :
Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations
Author/Authors :
Cemal Basaran and Rumpa Chandaroy، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1998
Keywords :
Electronic packing , solder joint , Vibration
Journal title :
Applied Mathematical Modelling
Journal title :
Applied Mathematical Modelling