Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead–tin alloy solder joint in electronics packaging

Yu-Fang Chiu، نويسنده , , Ying-Ling Tsai and Weng-Sing Hwang، نويسنده ,

روزنامه با شماره پیاپی سال 2003

15

565

579

Solder joint , Lead–tin alloy , reflow process , Solidification , Electronic packaging

Applied Mathematical Modelling

2003

Applied Mathematical Modelling

295890