Title of article
Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead–tin alloy solder joint in electronics packaging
Author/Authors
Yu-Fang Chiu، نويسنده , , Ying-Ling Tsai and Weng-Sing Hwang، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2003
Pages
15
From page
565
To page
579
Keywords
Solder joint , Lead–tin alloy , reflow process , Solidification , Electronic packaging
Journal title
Applied Mathematical Modelling
Serial Year
2003
Journal title
Applied Mathematical Modelling
Record number
295890
Link To Document