Title of article :
Pattern classification of solder joint images using a correlation neural network
Author/Authors :
J. H. Kim، نويسنده , , H. S. Cho، نويسنده , , S. Kim، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1996
Keywords :
Solder-joint inspection , printed-circuit board , neural network , surface-mounting technology , circular tiered illumination system
Journal title :
Engineering Applications of Artificial Intelligence
Journal title :
Engineering Applications of Artificial Intelligence
