Novel Approach of Twin-Side Thermal Interfacing of Integrated Power Modules for Reduced Thermal Impedance

J. Chang and C. Liao، نويسنده ,

روزنامه با شماره پیاپی سال 2006

8

625

632

maximumrated junction temperature , p–n junction temperature rise , twin-side thermal interfaces. , Automotive power electronics , integrated power modules (IPMs) , elevated temperatureoperations

IEEE TRANSACTIONS ON POWER ELECTRONICS

2006

IEEE TRANSACTIONS ON POWER ELECTRONICS

340835