Title of article :
Photoelastic Investigation of Bimaterial Interfacial Stresses Induced by Thermal Loading
Author/Authors :
W.-C. Wang and J.-C. Lin، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Pages :
6
From page :
143
To page :
148
Keywords :
Electronic packaging , Finite element method , photoelasticity , thermal stresses , Bimaterial
Journal title :
Strain
Serial Year :
2003
Journal title :
Strain
Record number :
342969
Link To Document :
https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=342969
