• Title of article

    Photoelastic Investigation of Bimaterial Interfacial Stresses Induced by Thermal Loading

  • Author/Authors

    W.-C. Wang and J.-C. Lin، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2003
  • Pages
    6
  • From page
    143
  • To page
    148
  • Keywords
    Electronic packaging , Finite element method , photoelasticity , thermal stresses , Bimaterial
  • Journal title
    Strain
  • Serial Year
    2003
  • Journal title
    Strain
  • Record number

    342969

    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=342969