Title of article
Investigation of Analytical Solutions for Bonded Structures by Photomechanical Methods
Author/Authors
W.-C. Wang and J.-S. Hsu، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2006
Pages
10
From page
107
To page
116
Keywords
Photoelasticity , Thermal stresses , bonded structures , Moire´ interferometry , Finite element method , Lateral displacement
Journal title
Strain
Serial Year
2006
Journal title
Strain
Record number
343033
Link To Document