Title of article
Evaluation of Residual Stress in Flip Chip Using 3-D Optical Interferometry/FEM Hybrid Technique
Author/Authors
F. Su، نويسنده , , L. Liu and T. Wang، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
10
From page
289
To page
298
Keywords
flip chip , Finite element , Residual stress , Moire´ interferometry
Journal title
Strain
Serial Year
2007
Journal title
Strain
Record number
343083
Link To Document