Title of article :
In-Situ strain analysis with high spatial resolution: A new failure inspection tool for integrated circuit applications
Author/Authors :
T. Nshanian، نويسنده , , R. Dove and Krishna Rajan، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1996
Keywords :
moiré fringes , SEM , voltage contrast , strain measurement , Semiconductor
Journal title :
Engineering Failure Analysis
Journal title :
Engineering Failure Analysis
