Title of article
In-Situ strain analysis with high spatial resolution: A new failure inspection tool for integrated circuit applications
Author/Authors
T. Nshanian، نويسنده , , R. Dove and Krishna Rajan، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1996
Pages
5
From page
109
To page
113
Keywords
moiré fringes , SEM , voltage contrast , strain measurement , Semiconductor
Journal title
Engineering Failure Analysis
Serial Year
1996
Journal title
Engineering Failure Analysis
Record number
349026
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