مرکز منطقه ای اطلاع رساني علوم و فناوري - Enhanced boiling heat transfer from electronic components by use of surface microstructures

Title of article :

Enhanced boiling heat transfer from electronic components by use of surface microstructures

Author/Authors :

H. Honda، نويسنده , , J. J. Wei، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 2003

Pages :

From page :

159

To page :

169

Journal title :

Experimental Thermal and Fluid Science

Serial Year :

2003

Journal title :

Experimental Thermal and Fluid Science

Record number :

350452

Link To Document :