Title of article
Enhanced boiling heat transfer from electronic components by use of surface microstructures
Author/Authors
H. Honda، نويسنده , , J. J. Wei، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2003
Pages
11
From page
159
To page
169
Journal title
Experimental Thermal and Fluid Science
Serial Year
2003
Journal title
Experimental Thermal and Fluid Science
Record number
350452
Link To Document