مرکز منطقه ای اطلاع رساني علوم و فناوري - A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies

Title of article :

A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies

Author/Authors :

Farhad Sarvar، نويسنده , , Paul P. Conway، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 1998

Pages :

From page :

To page :

Keywords :

PCA , simulation , Re?ow Soldering , thermal

Journal title :

FINITE ELEMENTS IN ANALYSIS & DESIGN

Serial Year :

1998

Journal title :

FINITE ELEMENTS IN ANALYSIS & DESIGN

Record number :

351134

Link To Document :