Title of article :
Integrated design method for flip chip CSP with electrical, thermal and thermo-mechanical qualifications
Author/Authors :
De-Shin Liu، نويسنده , , Chin-Yu Ni، نويسنده , , Ching-Yang Chen، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2002
Pages :
17
From page :
661
To page :
677
Journal title :
FINITE ELEMENTS IN ANALYSIS & DESIGN
Serial Year :
2002
Journal title :
FINITE ELEMENTS IN ANALYSIS & DESIGN
Record number :
351391
Link To Document :
https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=351391
