Title of article :
Generalized multi-domain method for fatigue analysis of interconnect structures
Author/Authors :
Mostafa Rassaian، نويسنده , , Jung-Chuan Lee، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Pages :
13
From page :
793
To page :
805
Keywords :
Ball grid array (BGA) , electronic packaging , Solder joints , Finite element method (FEM) , Multi-domain method (MDM) , Fatigue , Ceramic chip carrier (CCC) , Leaded device , Plated-through hole (PTH)
Journal title :
FINITE ELEMENTS IN ANALYSIS & DESIGN
Serial Year :
2003
Journal title :
FINITE ELEMENTS IN ANALYSIS & DESIGN
Record number :
351460
Link To Document :
https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=351460
بازگشت