Title of article
Simulation of drop/impact reliability for electronic devices
Author/Authors
Y.Y. Wang، نويسنده , , C. Lu، نويسنده , , J. Li، نويسنده , , X.M. Tan، نويسنده , , Y.C. Tse، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2004
Pages
14
From page
667
To page
680
Keywords
Finite element method , Drop test , Packaging material , Reliability , modeling and simulation , Virtual productdevelopment , Virtual test
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Serial Year
2004
Journal title
FINITE ELEMENTS IN ANALYSIS & DESIGN
Record number
351562
Link To Document