مرکز منطقه ای اطلاع رساني علوم و فناوري - ELASTOPLASTIC ANALYSIS OF W-Cu FUNCTIONALLY GRADED MATERIALS SUBJECTED TO A THERMAL SHOCK BY MICROMECHANICAL MODEL

Title of article :

ELASTOPLASTIC ANALYSIS OF W-Cu FUNCTIONALLY GRADED MATERIALS SUBJECTED TO A THERMAL SHOCK BY MICROMECHANICAL MODEL

Author/Authors :

Sei Ueda ، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 2001

Pages :

From page :

631

To page :

649

Journal title :

Journal of Thermal Stresses

Serial Year :

2001

Journal title :

Journal of Thermal Stresses

Record number :

355341

Link To Document :