Title of article
THERMAL STRESSES IN MICROELECTRONICS SUBASSEMBLIES: QUANTITATIVE CHARACTERIZATION USING PHOTOMECHANICS METHODS
Author/Authors
Bongtae Han ، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2003
Pages
31
From page
583
To page
613
Keywords
far infrared Fizeau interferometry , interconnections , microelectronicspackaging , microscopic moire´ interferometry , Moire´ interferometry , photomechanicsmethods , Shadow moire´ , Twyman=Green interferometry
Journal title
Journal of Thermal Stresses
Serial Year
2003
Journal title
Journal of Thermal Stresses
Record number
355462
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