Title of article :
Conditions for Cracking and Debond Development at Partially Bonded Bimaterial Half-Planes
Author/Authors :
N. Hasebe ، نويسنده , , X. Wang and M. Okumura ، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2004
Pages :
12
From page :
287
To page :
298
Keywords :
biomaterial , Half-plane , Interface crack , Stress intensity factor , Energy release rate , Debonding
Journal title :
Mechanics of Composite Materials
Serial Year :
2004
Journal title :
Mechanics of Composite Materials
Record number :
356203
Link To Document :
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