Title of article :
A modified mixed-mode bending specimen for the interfacial fracture testing of dissimilar materials
Author/Authors :
W. O. Soboyejo، نويسنده , , G.-Y. Lu، نويسنده , , S. Chengalva، نويسنده , , J. Zhang ، نويسنده , , V. Kenner، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Keywords :
copper/moulding compound , electronic packages. , dissimilar mixed-mode bending specimen , fracturetoughness , interfacial cracks
Journal title :
Fatigue and Fracture of Engineering Materials and Structures
Journal title :
Fatigue and Fracture of Engineering Materials and Structures
