Title of article :
Structural integrity in electronics
Author/Authors :
W. J. PLUMBRIDGE، نويسنده , , Y. KARIYA، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2004
Pages :
12
From page :
723
To page :
734
Keywords :
failure modes • lead-free solders • life prediction • solder joints • structural integrity
Journal title :
Fatigue and Fracture of Engineering Materials and Structures
Serial Year :
2004
Journal title :
Fatigue and Fracture of Engineering Materials and Structures
Record number :
359766
Link To Document :
https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=359766
بازگشت