Title of article :
Experimental evaluation of creep and fatigue behaviour for microscale solder interconnect
Author/Authors :
H. LU، نويسنده , , H. G. SHI، نويسنده , , M. ZHOU، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2007
Pages :
8
From page :
87
To page :
94
Keywords :
digital speckle correlation , Microelectronics , Reliability , solder joints.
Journal title :
Fatigue and Fracture of Engineering Materials and Structures
Serial Year :
2007
Journal title :
Fatigue and Fracture of Engineering Materials and Structures
Record number :
360011
Link To Document :
https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=360011
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